The primary goal of ARMAG [Advanced RF and Mixed-Signal Application Group] is the development of innovative circuits and system-level solutions for RF and mixed-signal applications. The research objective of ARMAG are inline with industry demands and is ensured by regular interaction with the industry members. As part of the NSF Center for Design of Analog and Digital Integrated Circuits (CDADIC), an industry and university consortium, ARMAG strives to create breakthroughs beneficial to the industry.

ARMAG was founded under the supervision of Dr. Deuk Heo in August 2003 at the School of Electrical Engineering and Computer Science, Washington State University.

• Multiple Open Positions for Ph.D. Candidate for Spring 2025 and Fall 2025
• Opening Position for Post Doctoral Candidate

• August 2024: Congratulation! Mokri’s journal paper has been accepted into IEEE Transactions on Microwave Theory and Techniques.
  “A Compact Single-ended Common-base Doherty PA in 90-nm BiCMOS with 37.3% Peak PAE for 5G Beamforming Arrays”
• August 2024: Congratulation! Amis’s journal paper has been accepted into IEEE Transactions on Microwave Theory and Techniques.
  “A Triple-band, High DC-to-RF Efficiency, Multi-core VCO with a Dual-path Inductor and Mode-Switching Capacitor”
• August 2024: Congratulation! Mokri’s conference paper is presented at ICC 2024-IEEE International Conference on Communications.
  “Custom Over-the-air Scalable mmWave Testbed for Fast TTD-Based Rainbow Beam Training”
• August 2024: Congratulation! Mokri’s journal paper is published in the IEEE Journal of Solid-State Circuits.
  “A Dual-Path Transformer-Based Multiband Power Amplifier for mm-Wave 5G Applications”
• January 2024: Congratulations! Dipan’s SSPLL paper is accepted in TCAS1.
• January 2024: Congratulations! Dr. Heo has been elevated to IEEE Fellow, effective 1 January 2024.
• January 2024: Congratulations Soumen! Your paper “An 8b 6-12GHz 0.18mW/GHz DC Modulated Ramp-based Phase Interpolator in 65nm CMOS Process” has been accepted for publication at the ISSCC 2024.

• January 2023: Congratulations Soumen for your IEEE Journal of Solid-State Circuits (JSSC) publication on a low-power phase-interpolator that is PVT tolerant and suited for large-scale arrays.
• January 2023: Congratulations Amin on your paper, Highly efficient multi-band harmonic-tuned GaN RF synchronous rectifier, in IEEE Transactions on Microwave Theory and Techniques (TMTT).

• December 2022: Congratulations Zhi on your published paper, an Inductor-First Single-Inductor Multiple-Output Hybrid DC–DC Converter With Integrated Flying Capacitor for SoC Applications, in IEEE Transactions on Circuits and Systems I (TCAS-I) 2022.
• June 2022: Congratulations to Amin and Soumen for winning the NSF RFIC’22 Travel Grant Awards. They will be presenting their accepted papers in IMS (Amin) and RFIC (Soumen), Denver, CO.
• March 2022: Congratulations Soumen on your paper acceptances on a low power phase interpolator into the Radio Frequency Integrated Circuits Symposium (RFIC), Denver, CO to be presented in June 2022.
• February 2022: Congratulations Amin on your paper acceptances on a low phase noise 28 GHz VCO using a transformer-based Q-enhanced active impedance converter into the IEEE International Microwave Symposium (IMS), Denver, CO to be presented in June 2022.

• July 2021: Congratulations Jake and Mohammad on your paper acceptance wideband RFI cancellation using true-time delays and a Hadamard projection operator into the IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, to be presented in Dec. 2021.
• June 2021: Congratulations Wook on graduating (Ph.D., Dec. 2020). Wook will join Analog Devices Inc., in Phoenix, AZ from September 2021.
• May 2021: Congratulations Chung-Chin, Chase, and Soumen on your paper acceptance on A 4-Element 800MHz-BW 29mW True-Time-Delay Spatial Signal Processor into the IEEE European Solid-State Circuits Conference (ESSCIRC), to be presented in Sept. 2021.
• April 2021: Congratulations Amin and Mohammad on your paper acceptance in TechCON, Austin, TX, 2021.

• Nov 2020: Congratulations Pawan on your article acceptance on boosted active-capacitor with negative-gm for wide tuning range VCOs into IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I) 2020.
• Nov 2020: Congratulations Nghia on your article acceptance of a fully integrated switched-inductor-capacitor voltage regulator into IEEE Journal of Solid-State Circuits (JSSC) 2020.
• Aug 2020: Congratulations Srini on your article acceptance on a hybrid 3D Interconnect employing orthogonal simultaneous bidirectional signaling into IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I) 2020.
• June 2020: Congratulations Amin, Mohammad, and Pawan on your paper acceptance in International Microwave Symposium (IMS), Los Angeles, CA, 2020. Amin and Pawan’s paper on an octave-range triple-band VCO using a dual-path inductor was selected as a student paper competition finalist.
• May 2020: Congratulations Wook on your article acceptance on design and analysis of multiple-output switched-capacitor voltage regulators with a reduced number of power electronic components into IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I) 2020.
• April 2020: Congratulations Aqeeb and Srini on your article acceptance on partially connected 3D NoC using NFIC and TSV in ACM Journal on Emerging Technologies in Computing Systems (JETC), 2020.
• Mar 2020: Congratulations Zhi on your paper acceptance on multi-output switched-capacitor voltage regulator via machine learning into Design, Automation & Test in Europe Conference & Exhibition (DATE), Grenoble, France, 2020.
• Mar 2020: Congratulations Zhi on your paper acceptance on wide output voltage range single-input-multi-output hybrid DC-DC converter into IEEE Custom Integrated Circuits Conference (CICC), Boston, MA, 2020.
• Feb 2020: Congratulations Bai on your article acceptance on clock-voltage co-regulator with adaptive power budget tracking into IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I) 2020.

• Dec 2019: Congratulations Wook on your article acceptance on dual-output step-down switched-capacitor voltage regulator into IEEE Transactions on Very Large Scale Integration (VLSI) Systems (TVLSI) 2019.
• Oct 2019: Congratulations Srini on your paper acceptance on design methodology proximity communication based contactless 3D interface into IEEE International 3D Systems Integration Conference (3DIC), Sendai, Japan, 2019.
• June 2019: Congratulations Amin, Srini and Sheikh on your papers’ acceptance in IEEE International Microwave Symposium (IMS), Boston, MA, 2019.
• June 2019: Congratulations Joe on your article acceptance on Ka-band dual-band digitally controlled oscillator into IEEE Transactions on Microwave Theory and Techniques (TMTT), 2019.
• April 2019: Congratulations Bai on your paper acceptance on sub-1V analog-assisted inverter-based digital low-dropout regulator into IEEE Custom Integrated Circuits Conference (CICC), Austin, TX, 2019.

• Dec 2018: Congratulations to Sheikh Nijam Ali on being awarded the Predoctoral Achievement Award for 2018-19 by IEEE Solid-State Circuits Society Awards Committee. This is a prestigious award, and Sheikh is the first student from WSU since 2003 to be awarded this honor.
• Dec 2018: Congratulations to Sheikh and Srini on their graduation. Best wishes for all your future endeavors.
• Nov 2018: Congratulations Luke on your article acceptance on the analysis of systematic losses in enveloping tracking modulators into IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I) 2018.
• Oct 2018: Congratulations Nghia on your paper acceptance into IEEE International Solid State Circuits Conference (ISSCC) San Francisco, CA, 2019.
• Aug 2018: Congratulations Srini on your article acceptance on High-Performance and Small Form-factor Near-field Inductive Coupling for 3D Network-on-Chip into IEEE Transactions on Very Large Scale Integrations Systems (TVLSI) 2018.
• July 2018: Congratulations Sheikh on your article acceptance on mmWave Continuous Class-F CMOS Power Amplifier for 5G into IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I) 2018.
• July 2018: Congratulations Joe on your article acceptance on an inductorless wideband amplifier for Wireless Network-on-Chip into IEEE Transactions on Very Large Scale Integrations Systems (TVLSI) 2018.
• June 2018: [Popular article] Congratulations Srini on your article acceptance on spatial multi-bit time-domain matrix multiplier for Approximate Computing into the special issue of IEEE Journal on Emerging and Selected Topics in Circuits and Systems (JETCAS) 2018 on Energy-Quality Scalable Circuits and Systems for Sensing and Computing: From Approximate to Communication-Inspired and Learning-Based.
• June 2018: Congratulations Nghia on your article acceptance on Analog-Assisted Digital Capacitor-Less Low-Dropout Regulator into IEEE Transactions on Industrial Electronics (TIE) 2018.
• Apr 2018: Congratulations Srini on your paper acceptance on CMOS Mixer Cell Ring Oscillator based Dot Product Circuit for High Throughput Computing into IEEE International Symposium on Circuits and Systems-Late Breaking News (ISCAS) 2018.
• Feb 2018: [Best Paper Candidate] Congratulations Srini on your paper acceptance on hybrid 3D interconnects for simultaneous bidirectional vertical communication into IEEE MTTS International Microwave Symposium (IMS) 2018.
• Feb 2018: Congratulations Joe on your paper acceptance on low power active-passive W-band oscillator into IEEE MTTS International Microwave Symposium (IMS) 2018.
• Jan 2018: Congratulations Professor Heo on your patent application approval titled “THREE DIMENSIONAL CIRCUITS”, USPTO application no. 14/964,45.
• Jan 2018: [Popular article] Congratulations Sheikh on your journal article acceptance on reconfigurable 28 GHz CMOS PA for 5G Radios into IEEE Transactions on Microwave Theory and Techniques (TMTT).
• Jan 2018: Congratulations Pawan on your journal article acceptance on feedforward spur cancellation technique in CMOS Ring PLLs into IEEE Transactions on Very Large Scale Integrations Systems (TVLSI).

• Oct 2017: Congratulations Sheikh on your paper acceptance on 28 GHz highly linear PA with AM-PM distortion correction into IEEE International Solid-State Circuits Conference (ISSCC), San Francisco, CA, Feb 2018.
• Oct 2017: Congratulations Sheikh on your article acceptance into IEEE Microwave Components and Letters (MWCL).
• Oct 2017: [Invited Special Session] Congratulations Srini on your paper acceptance into IEEE/ACM International Conference On Computer Aided Design (ICCAD), Irvine, CA, Nov 2017.
• Sep 2017: Prof. Heo will present a talk on mmWave reconfigurable architecture design at SKKU, Seoul, South Korea.
• Aug 2017: [Best Paper Candidate] Congratulations Srini on your paper acceptance in IEEE/ACM International Symposium on Network on Chips (NoCS), Seoul, South Korea, Oct 2017.
• Jul 2017: [Invited] An invited paper from our group’s work on Reconfigurable Phased-Array Design Techniques for 5G is to appear in IEEE International Symposium on Radio-Frequency Integration Technology (RFIT), Seoul, Korea, Sept. 2017.
• Jun 2017: Sheikh presented his work on Continuous Inverse Class-F PA design at 28 GHz design for 5G applications in 65nm CMOS at Radio Frequency Integrated Circuits Symposium (RFIC), Honolulu, HI 2017.
• Jun 2017: Sheikh presented his work on reconfigurable mmWave PA design at 28 GHz design in 65nm CMOS for 5G applications at International Microwave Symposium (IMS), Honolulu, HI 2017.
• Mar 2017: Congratulations to Prof. Heo for being appointed as Frank Brands Analog Distinguished Professor.
• Feb 2017: Congratulations Sheikh and Pawan on paper acceptance in Radion Frequency Integrated Circuits Symposium (RFIC) 2017.
• Jan 2017: Congratulations Sheikh, Joe, and Pawan on your paper acceptance in International Microwave Symposium (IMS) 2017.
• Jan 2017: Congratulations Joe, Sheikh, Pawan, and Srini on your paper acceptance in International Microwave Symposium (IMS) 2017.

• Nov 2016: Nghia and Zhi’s journal article on PWM-Skipping Technique is now available online in International Journal of Electronics Letters. [ARTICLE]
• Jul 2016: Nghia and Bai’s journal article on Fully Integrated Buck Converter is now available online in IEEE Transactions on Power Electronics (TIPE) (Impact factor = 7.151) [ARTICLE]
• Jun 2016: Pawan and Tai presented their work on reconfigurable capacitively coupled VCO at International Microwave Symposium (IMS), San Francisco, CA.
• May 2016: Suman and Pawan presented their work on 4-channel mmWave beamforming receiver array in IEEE International Symposium on Circuits and Systems (ISCAS), Montreal, QC, Canada.
• Mar 2016: Prof. Heo conducted a workshop on High Performance Inter- and Intra-chip Wireless Interconnection for Future ICs: Promises and Challenges in IEEE International Wireless Symposium (IWS), Shanghai, China 14-16 March.
• Jun 2015: Congratulations Pawan on your second best student paper award for presenting the highest state-of-the-art tuning range (33%) VCO at 25 GHz.